ThinkSystem SD650-I V3

The ThinkSystem SD650-I V3 Neptune DWC node is the next-generation high-performance server based on the fifth generation Lenovo Neptune™ direct water cooling platform.

With two 5th Gen Intel Xeon Scalable or Intel Xeon CPU Max Series processors, along with four powerful Intel Data Center Max Series GPUs, the ThinkSystem SD650-I V3 server features the latest technology from Intel, combined with Lenovo's market-leading water-cooling solution, which results in extreme performance in an extreme dense packaging, supporting your application from Exascale to Everyscale™.

The direct water cooled solution is designed to operate by using warm water, up to 45°C (113°F) depending on the configuration. Chillers are not needed for most customers, meaning even greater savings and a lower total cost of ownership. The nodes are housed in the upgraded ThinkSystem DW612S enclosure, a 6U rack mount unit that fits in a standard 19-inch rack.

The Lenovo ThinkSystem SD650-I V3 server tray is designed for High Performance Computing (HPC), large-scale cloud, heavy simulations, and modeling. It implements Lenovo Neptune™ Direct Water Cooling (DWC) technology to optimally support workloads from technical computing, grid deployments, analytics, and is ideally suited for fields such as research, life sciences, energy, simulation, and engineering.

The unique design of ThinkSystem SD650-I V3 provides the optimal balance of serviceability, performance, and efficiency. By using a standard rack with the ThinkSystem DW612S enclosure equipped with patented stainless steel drip-less quick connectors, the SD650-I V3 provides easy serviceability and extreme density that is well suited for clusters ranging from small enterprises to the world's largest supercomputers.

The Lenovo Neptune™ direct liquid cooling doesn't use risky plastic retrofitting but instead custom-designed copper water loops, so you have peace of mind implementing a platform with liquid cooling at the core of the design.

Compared to other technology, the SD650-I V3 direct water cooling:

• Reduces data center energy costs by up to 40%
• Increases system performance by up to 10%
• Delivers up to 100% heat removal efficiency (depending on the environment)
• Creates a quieter data center with its fan-less design
• Enables data center growth without adding computer room air conditioning

Lenovo’s direct water-cooled solutions are factory-integrated and are re-tested at the rack-level to ensure that a rack can be directly deployed at the customer site. This careful and consistent quality testing has been developed as a result of over a decade of experience designing and deploying DWC solutions to the very highest standards.

Scalability and performance

The ThinkSystem SD650-I V3 server tray and DW612S enclosure offer the following features to boost performance, improve scalability, and reduce costs:

• Each SD650-I V3 node supports two high-performance Intel Xeon processors, four Intel Data Center GPU Max Series accelerators, 32x TruDDR5 DIMMs, two OSFP 800G cages for high-speed I/O, and up to two drive bays, all in a 1U form factor.
• Up to 6x SD650-I V3 nodes are installed in the DW612S enclosure, occupying only 6U of rack space. It is a highly dense, scalable, and price-optimized offering.
• Each node supports one or two 5th Gen Intel Xeon Processor Scalable processors
• Up to 64 cores and 128 threads
• Core speeds of up to 3.9 GHz
• TDP ratings of up to 385 W
• Alternatively, each node supports one or two 4th Gen Intel Xeon Processor Scalable processors
• Up to 60 cores and 120 threads
• Core speeds of up to 3.7 GHz
• TDP ratings of up to 350 W
• Alternatively, each node supports one or two Intel Xeon Max Series processors
• Integrated 64GB High Bandwidth Memory (HBM)
• Up to 56 cores and 112 threads
• Core speeds of up to 2.7 GHz
• TDP ratings of up to 350 W
• Supports four Intel Data Center GPU Max Series accelerators
• Up to 128 Xe-HPC Cores per GPU
• Up to 512 GB of HBM2e with an aggregate bandwidth of 12.8 TB/s
• Up to 128 Ray Tracing units
• TDP ratings up to 600W per GPU
• Up to 52 teraFLOPS Peak FP64 throughput per GPU
• Support for DDR5 memory DIMMs to maximize the performance of the memory subsystem:
• Up to 16 DDR5 memory DIMMs, 8 DIMMs per processor
• 8 memory channels per processor (1 DIMM per channel)
• Supports 1 DIMM per channel operating at 5600 MHz (5th Gen processors) or 4800 MHz (4th Gen processors)
• Using 128GB 3DS RDIMMs, the server supports up to 2TB of system memory
• Supports combinations of PCIe 5.0 x16 slots and SSD drive bays, as follows:
• One PCIe 5.0 x16 slot and either two 7mm SSDs or two E3.S EDSFF SSDs (E3.S support is planned for 2024)
• One PCIe 5.0 x16 slot and one 15mm SSD
• Two PCIe 5.0 x16 slots (also supports one M.2 drive)
• The server is Compute Express Link (CXL) v1.1 Ready. With CXL 1.1 for next-generation workloads, you can reduce compute latency in the data center and lower TCO. CXL is a protocol that runs across the standard PCIe physical layer and can support both standard PCIe devices as well as CXL devices on the same link.
• Drives can be either SATA or high-performance NVMe drives, to maximize I/O performance in terms of throughput, bandwidth, and latency.
• Supports a PCIe 4.0 x4 high-speed M.2 NVMe drive installed in an adapter for convenient operating system boot and internal storage functions.
• The node includes one Gigabit and two 25 Gb Ethernet onboard ports for cost effective networking.
• The node offers PCI Express 5.0 I/O expansion capabilities that doubles the theoretical maximum bandwidth of PCIe 4.0 (32GT/s in each direction for PCIe 5.0, compared to 16 GT/s with PCIe 4.0). A PCIe 5.0 x16 slot provides 128 GB/s bandwidth, enough to support a 400GbE network connection.