Compal SD223-8A-L1
Next-Generation High-Density HPC with Ultra Performance and Minimal Power Consumption.
Introducing the latest-generation 2U 8-CPU Direct Liquid Cooling HPC platform, engineered for ultra-high density computing, exceptional performance, and optimized energy efficiency. Designed to maximize compute power within a compact 2U footprint, this advanced system delivers superior thermal management through direct liquid cooling, enabling higher sustained performance while reducing power consumption. With an improved PUE (Power Usage Effectiveness), it is the ideal solution for next-generation HPC, and data center deployments seeking maximum performance with lower operating costs.
Certifications
Red Hat certified hardware is proven to incorporate Red Hat's best practices and provides customers tested interoperability, known life cycle management, and trusted support.
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Red Hat Enterprise Linux 10.1 - 10.x Architecture: x86_64 |
