Tyrone Camarero SDI200A3H-460
5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP, • Intel C741® Chipset
5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP,•Intel C741® Chipset•Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots•4 PCIe 5.0 x16 (in x16 slot),2 PCIe 5.0 x16 AIOM Slot, AIOM slots Superset of OCP 3.0 Expansion M.2 Interface: 2 PCIe 3.0 x2•2 AIOM OCP 3.0 superset•8 NVMe ports PCIe 5.0 x8 via 8 MCIO connectors•2 M.2•1 VGA•2 USB 2.0 and 2 USB 3.0
Certifications
Red Hat certified hardware is proven to incorporate Red Hat's best practices and provides customers tested interoperability, known life cycle management, and trusted support.
| Compare | Product | Level | |
|---|---|---|---|
Red Hat OpenStack Services on OpenShift 18.0 - 18.x Base OS: Red Hat Enterprise Linux 9.0 Architecture: x86_64 | |||
Red Hat OpenStack Platform 17.0 - 17.x Base OS: Red Hat Enterprise Linux 9.0 Architecture: x86_64 | |||
Red Hat Enterprise Linux 9.0 - 9.x Architecture: x86_64 | |||
Red Hat OpenShift Container Platform 4.13 - 4.x Base OS: Red Hat Enterprise Linux 9.0 Architecture: x86_64 |
